TSMC's next-gen 2nm silicon is reportedly on track for later this year but don't expect chips for PCs until 2027 and beyond
But it seems Taiwanese megfab TSMC is determined to crank out new silicon regardless. The latest reports claim TSMC's ...
TSMC Q4 profit set for big leap on strong demand for AI chips
Taiwan Semiconductor Manufacturing Co, the main global producer of advanced chips used in artificial intelligence ...
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TSMC maintains CoWoS equipment orders despite Nvidia demand concerns
TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate ...
TSMC: A Growth Story That's Still Undervalued
TSMC's strong Q4 results and projected revenue growth in 2025 due to AI hardware demand suggest undervalued growth potential.
Nvidia CPUs might be coming to laptops sooner than we thought
Leaks suggest Nvidia is collaborating with Lenovo on a powerful new chip that will be featured in its Yoga line of laptops.
Nvidia to Reduce CoWoS-S Capacity, Focus on CoWoS-L Technology, TF International Analyst Says
Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.
Apple, Nvidia Supplier TSMC Expects Surge in Profit As AI Chip Demand Grows
The world's largest contract chipmaker, whose customers include Apple and Nvidia, has benefited from the megatrend towards AI ...
Apple and Nvidia chip supplier TSMC’s sales top estimates, boosting AI’s 2025 outlook
The world’s largest contract chipmaker reported a 39 per cent rise in October-December revenue to US$26.3 billion.
TSMC fourth-quarter profit seen jumping 58% on strong AI chip demand
Taiwan Semiconductor Manufacturing Co, the main global producer of advanced chips used in artificial intelligence ...
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TSMC breaks record with December revenue backed by relentless AI demand
TSMC is making headlines again with its AI exploits. The world’s largest chipmaker raked in 868.5 billion New Taiwan dollars ...
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Nvidia reportedly prioritizing dual-die Blackwell GPUs with CoWoS-L packaging
Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.