The ESPR and its varied requirements are set to significantly impact a variety of industries and business operations.

HighTec EDV-Systeme, a provider of automotive C/C++ compiler solutions, has announced that it has added support for Nuclei ...

The US Administration unveils tough new restrictions on the export of advanced computer chips and other AI technology.

The SiT5977 replaces multiple timing components and optimises the efficiency of AI compute clusters with 3X tighter ...

The additions include the G9EK-1-UTU and G9EK-1-E which provide compact yet high-capacity gasless interruption for large ...

Quantum Science has secured grant funding to further expand its work on QDs for high-speed imaging and sensing.

NXP has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investment.

Vertical Compute raises funds to develop vertical integrated memory and compute technology to tackle AI memory issues.

Capable of delivering up to 5kV across 26 or 34 contacts in a compact Ø18 mm design, these connectors provide unmatched ...

Based on Qualcomm Technologies’ Snapdragon Auto Connectivity Platform and the QCA6797AQ, the industry’s first automotive grade Wi-Fi 7 access point solution, the RUBY-W2 series supports 2x2 MIMO Multi ...

Display solutions and embedded systems provider, Review Display Systems (RDS) has announced the availability of a range of new Memory-in-Pixel (MIP) display modules. Each individual pixel in a MIP ...

Plessey Semiconductors and Meta Platforms have developed what is claimed to be the world's brightest red microLED display suitable for augmented reality (AR) glasses. World's brightest red MicroLED ...