These projects would increase its domestic manufacturing capacity and create up to 1,700 manufacturing and construction jobs.

The CHIPS Act has been sparking conversation with both presidential candidates as well as House and Senate members.

Taiwan Semiconductor Mfg. Co. Ltd. (NYSE:TSM) is set to double its production capacity for advanced packaging, a move driven ...

The department said Monday the second facility, the CHIPS for America Design and Collaboration Facility, or DCF, will be ...

The Kyoto-based company has set aside $60 million to invest in early-stage startups in the U.S., the Middle East and Africa through its Kyocera Venture Fund-I over a 10-year period. It is pouring ...

Intel plans to invest $300 million to expand its chip packaging and testing base in Chengdu, China. According to a report ...

US semiconductor giant Intel said it would expand its chip packaging and testing base in Chengdu, in a show of commitment to ...

As the global chip war between China and the US reaches a fever pitch, a quiet giant is emerging to take the spotlight.

Japan's component manufacturer Kyocera Corporation is experiencing a downturn in its semiconductor organic packaging ...

The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced ...

Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This ...